Title:
METHOD FOR MANUFACTURING CONNECTION STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2017/163721
Kind Code:
A1
Abstract:
Provided is a method for manufacturing a connection structure in which the allowable range of a terminal interval in a member can be enlarged and which can be mounted at low temperature. The method comprises: an arranging step for arranging a first electronic component including a first terminal row and a second electronic component including a second terminal row facing the first terminal row, while having interposed therebetween a thermosetting anisotropic conductive adhesive including conductive particles; a thermally compressing step for thermally compressing the first electronic component and the second electronic component such that the conductive particles are held between the first terminal row and the second terminal row; and a full-curing step for fully curing the anisotropic conductive adhesive through irradiation with infrared laser light in a state in which the conductive particles are held between the first terminal row and the second terminal row.
Inventors:
OZEKI HIROKI (JP)
Application Number:
PCT/JP2017/006438
Publication Date:
September 28, 2017
Filing Date:
February 21, 2017
Export Citation:
Assignee:
DEXERIALS CORP (JP)
International Classes:
H05K3/36; C09J4/00; C09J9/02; C09J11/04; C09J201/00; H01R11/01; H01R43/00; H05K3/32; H01L21/60
Domestic Patent References:
| WO2000045431A1 | 2000-08-03 |
Foreign References:
| JPH09260820A | 1997-10-03 | |||
| JP2010199527A | 2010-09-09 | |||
| JP2008216891A | 2008-09-18 | |||
| JP2014102943A | 2014-06-05 |
Attorney, Agent or Firm:
NOGUCHI, Nobuhiro (JP)
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