METHOD FOR MANUFACTURING CURED PRODUCT, RESIN COMPOSITION, DEVELOPING SOLUTION, METHOD FOR MANUFACTURING LAYERED BODY, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

WIPO Patent Application WO/2022/044521

A1

The present invention provides: a method for manufacturing a cured product having superior resolution; a resin composition and developing solution used in the method for manufacturing a cured product; a method for manufacturing a layered body, said method including the method for manufacturing a cured product; and a method for manufacturing an electronic device, said method including the method for manufacturing a cured product or the method for manufacturing a layered body. The method for manufacturing a cured product includes: a film formation step using a resin composition that includes a resin, a compound that generates an acid by exposure, and a solvent; an exposure step; a developing step; and a modifying step, the resin being a polyimide precursor and having a group that generates a reaction in which polarity is increased due to the effect of the acid, the content of an organic solvent in the developing solution being 80 mass% or more, and the solubility of the pattern in the solvent included in the resin composition being reduced by the modification.

SHIMADA KAZUTO (JP)
NOZAKI ATSUYASU (JP)
TAKASHIMA MISAKI (JP)

PCT/JP2021/024077

March 03, 2022

June 25, 2021

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FUJIFILM CORP (JP)

G03F7/004; G03F7/038; G03F7/20; G03F7/32; G03F7/38; G03F7/40

WO2013141376A1	2013-09-26
WO2018199247A1	2018-11-01

JP2009244479A

2009-10-22

NAKASHIMA Junko et al. (JP)

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