Title:
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/044522
Kind Code:
A1
Abstract:
The present invention relates to a substrate processing method for preventing cracking and chipping of a laminate substrate manufactured by joining a plurality of substrates. The present invention further relates to a substrate processing device capable of implementing such substrate processing method. The method comprises: rotating a laminate substrate (Ws) manufactured by joining a first substrate (W1) and a second substrate (W2); applying a filler (F) having thermoset properties to a gap between a peripheral portion of the first substrate (W1) and a peripheral portion of the second substrate (W2); and curing the filler (F). The step of applying the filler (F) and the step of curing the filler (F) are performed successively in the same processing chamber (21).
Inventors:
SATAKE MASAYUKI (JP)
NAKANISHI MASAYUKI (JP)
YAMASHITA MICHIYOSHI (JP)
NAKANISHI MASAYUKI (JP)
YAMASHITA MICHIYOSHI (JP)
Application Number:
PCT/JP2021/024080
Publication Date:
March 03, 2022
Filing Date:
June 25, 2021
Export Citation:
Assignee:
EBARA CORP (JP)
International Classes:
H01L21/02; H01L21/304
Foreign References:
| JP2014167966A | 2014-09-11 | |||
| JP2006352078A | 2006-12-28 | |||
| JP2014063955A | 2014-04-10 |
Attorney, Agent or Firm:
HIROSAWA, Tetsuya et al. (JP)
Download PDF: