Title:
METHOD FOR MANUFACTURING CYLINDRICAL SPUTTERING TARGET, AND CYLINDRICAL SPUTTERING TARGET
Document Type and Number:
WIPO Patent Application WO/2022/045054
Kind Code:
A1
Abstract:
This method for manufacturing a cylindrical sputtering target has: a primary coating step for forming a primary coat layer, by using a primary coat solder made of In, Sn, or an Sn-In alloy, on a joint surface of each of a cylindrical sputtering target material and a backing tube; an assembling step for assembling the sputtering target material and the backing tube after the primary coating step; and a solder joining step for joining the assembled sputtering target material and the backing tube by using joining solder made of an Sn-In-Zn-based alloy containing Sn, In, and Zn.
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Inventors:
OKANO SHIN (JP)
OHTOMO TAKESHI (JP)
OHTOMO TAKESHI (JP)
Application Number:
PCT/JP2021/030772
Publication Date:
March 03, 2022
Filing Date:
August 23, 2021
Export Citation:
Assignee:
MITSUBISHI MATERIALS CORP (JP)
International Classes:
B23K1/00; B23K35/26; C22C13/00; C22C28/00; C23C14/34
Foreign References:
| JP2015036431A | 2015-02-23 | |||
| JP2012132065A | 2012-07-12 | |||
| JP2006257511A | 2006-09-28 | |||
| JP2016089181A | 2016-05-23 |
Attorney, Agent or Firm:
MATSUNUMA Yasushi et al. (JP)
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