Title:
METHOD FOR MANUFACTURING ELECTRONIC COMPONENT DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/047872
Kind Code:
A1
Abstract:
The present invention discloses a method for manufacturing an electronic component, the method comprising: preparing an intermediate structure comprising a substrate having a first main surface and a second main surface on the rear side of the first main surface and a wiring layer provided on the first main surface and having an insulating resin layer and wiring, the substrate having a resin portion including a penetration portion extending through the substrate from the first main surface to the second main surface, the wiring layer forming a trench having a bottom surface where the penetration portion is exposed; and cutting the penetration portion along the trench to form a plurality of wiring structures having the substrate divided through the cutting.
Inventors:
IMAZU YUKI (JP)
HATAKEYAMA KEIICHI (JP)
AOYAMA MOTOO (JP)
KANG DONGCHUL (JP)
KATO SADAAKI (JP)
UENO KEIKO (JP)
HIRANO KAZUE (JP)
MATSUBARA HIROAKI (JP)
ITAGAKI KEI (JP)
TOBA MASAYA (JP)
HATAKEYAMA KEIICHI (JP)
AOYAMA MOTOO (JP)
KANG DONGCHUL (JP)
KATO SADAAKI (JP)
UENO KEIKO (JP)
HIRANO KAZUE (JP)
MATSUBARA HIROAKI (JP)
ITAGAKI KEI (JP)
TOBA MASAYA (JP)
Application Number:
PCT/JP2022/033144
Publication Date:
March 07, 2024
Filing Date:
September 02, 2022
Export Citation:
Assignee:
RESONAC CORP (JP)
International Classes:
H05K3/00; H05K1/02; H05K3/46
Domestic Patent References:
| WO2012165530A1 | 2012-12-06 | |||
| WO2014041696A1 | 2014-03-20 |
Foreign References:
| JPH08288647A | 1996-11-01 | |||
| JP2018046266A | 2018-03-22 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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