Title:
METHOD FOR MANUFACTURING ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2022/168768
Kind Code:
A1
Abstract:
A method for manufacturing an electronic component 1 according to the present invention comprises: a step for preparing electronic component element bodies 9 in each of which an inner electrode 3 is provided and the inner electrode 3 is exposed from an outer surface 9a thereof; and a first electrode layer formation step for forming a first electrode layer 11a by jetting metal fine particles 53 to the outer surface 9a of each of the electronic component element bodies 9 so as to cause the particles to be collided with the outer surface 9a, in a state where the pressure is lower than the atmospheric pressure.
Inventors:
ARITOMI KATSUTOMO (JP)
UEDA YASUHIKO (JP)
YOSHINO YOSHIMASA (JP)
UEDA YASUHIKO (JP)
YOSHINO YOSHIMASA (JP)
Application Number:
PCT/JP2022/003487
Publication Date:
August 11, 2022
Filing Date:
January 31, 2022
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01G4/30; H01G9/00
Foreign References:
| JP2007208112A | 2007-08-16 | |||
| JP2011153329A | 2011-08-11 | |||
| JP2011108875A | 2011-06-02 | |||
| JP2009076872A | 2009-04-09 | |||
| JPH06291380A | 1994-10-18 | |||
| JP2020141059A | 2020-09-03 |
Attorney, Agent or Firm:
YASUTOMI & ASSOCIATES (JP)
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