METHOD FOR MANUFACTURING ELECTRONIC DEVICE

Title:

METHOD FOR MANUFACTURING ELECTRONIC DEVICE

Document Type and Number:

WIPO Patent Application WO/2019/203048

Kind Code:

A1

Abstract:

A method for manufacturing an electronic device according to the present invention is a method for manufacturing an electronic device provided with a substrate having, formed on the surface thereof, a metal-exposed part and an electronic component provided on the substrate, the method comprising a flux treatment step of bringing the metal-exposed part into contact with a flux to treat the metal-exposed part with the flux and an introduction step of introducing a resin composition so as to allow the resin composition to contact with the surface of the flux-treated metal-exposed part, wherein the flux contains rosin, an activating agent and a solvent, the content of rosin is 1 to 18 parts by mass inclusive relative to 100 parts by mass of the flux, the ratio of change in mass of the flux before and after a heat treatment of the flux is 21% by mass or less, the resin composition contains an epoxy resin and a phenolic resin curing agent, and SP1 and Mn1 meet the requirement represented by the formula: Mn1 ≤ 210×SP1-4095 in the resin composition wherein SP1 represents the average solubility parameter of a resin group consisting of the epoxy resin and the phenolic resin curing agent as determined in accordance with a Hansen method and Mn1 represents the number average molecular weight of the resin group.

Inventors:

KAZAMA TATSUYA (JP)
KAWANAGO TOMOHISA (JP)
NISHIZAKI TAKAHIRO (JP)

Application Number:

PCT/JP2019/015339

Publication Date:

October 24, 2019

Filing Date:

April 08, 2019

Export Citation:

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Assignee:

SUMITOMO BAKELITE CO (JP)
SENJU METAL INDUSTRY CO (JP)

International Classes:

H01L21/56; C08G59/62; C08K3/00; C08K5/54; C08L63/00; H01L21/60; H01L23/29; H01L23/31

Foreign References:

JP2008226926A	2008-09-25
JP2007189210A	2007-07-26
JP2006193595A	2006-07-27