Title:
METHOD FOR MANUFACTURING FLEXIBLE ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/054476
Kind Code:
A1
Abstract:
Disclosed is a method for manufacturing a flexible electronic device, the method comprising: (a) a step for applying, onto a substrate, a polyimide precursor composition which contains a polyimide precursor, and needle-like fine particles and a solvent in an amount greater than 2 parts by mass and less than 33 parts by mass with respect to 100 parts by mass of the polyimide precursor; (b) a step for heating the polyimide precursor composition on the substrate to manufacture a laminate in which a polyimide film is laminated on the substrate; (c) a step for forming, on the polyimide film of the laminate, at least one layer selected from among a conductor layer and a semiconductor layer; and (d) a step for peeling the substrate and the polyimide film by using an external force. A flexible electronic device can be manufactured by a simple method using an industrially simple apparatus.
Inventors:
FUKATA HIROTO (JP)
OKA TAKUYA (JP)
SAKAI TOSHIHITO (JP)
OKA TAKUYA (JP)
SAKAI TOSHIHITO (JP)
Application Number:
PCT/JP2020/035640
Publication Date:
March 25, 2021
Filing Date:
September 18, 2020
Export Citation:
Assignee:
UBE INDUSTRIES (JP)
International Classes:
B32B27/34; C08G73/10; C08J5/18; C08K7/00; H01L23/28; H01L23/29; H01L23/31; C08L79/08
Domestic Patent References:
| WO2019059319A1 | 2019-03-28 |
Foreign References:
| JP2019045804A | 2019-03-22 | |||
| JP2019144347A | 2019-08-29 | |||
| JP2018060064A | 2018-04-12 |
Attorney, Agent or Firm:
ITO Katsuhiro (JP)
Download PDF: