METHOD FOR MANUFACTURING JOINED BODY AND METHOD FOR JOINING BODY TO BE JOINED

WIPO Patent Application WO/2023/190080

A1

Provided is a method for manufacturing a joined body formed by joining a first body to be joined and a second body to be joined via a joining layer. A coating is formed by applying a paste containing copper particles and an organic solvent to the first body to be joined. A laminate is formed by placing the second body to be joined on the coating. In a first heating step, the laminate is incrementally heated. In a second heating step, the laminate is heated at a temperature that is equal to or greater than the heating temperature in the first heating step and equal to or less than 250°C to form a joining layer by sintering the copper particles in the coating. The first heating step is performed in an inert atmosphere. The second heating step is performed in a reducing atmosphere.

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KONNO SATOSHI (JP)
YAMAUCHI SHINICHI (JP)
ANAI KEI (JP)

PCT/JP2023/011636

October 05, 2023

March 23, 2023

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MITSUI MINING & SMELTING CO LTD (JP)

H01L21/52; B22F7/08; B22F9/00

WO2020066968A1	2020-04-02
WO2019093121A1	2019-05-16
WO2022185571A1	2022-09-09

JP2018170228A	2018-11-01
JP2020113662A	2020-07-27
JP2014199852A	2014-10-23
JP2020087766A	2020-06-04
JP2019110264A	2019-07-04
JP2017155166A	2017-09-07
JP2016011448A	2016-01-21
JP2018092798A	2018-06-14

SHOWA INTERNATIONAL PATENT FIRM (JP)

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