Title:
METHOD FOR MANUFACTURING METAL-FILLED MICROSTRUCTURE
Document Type and Number:
WIPO Patent Application WO/2021/153112
Kind Code:
A1
Abstract:
Provided is a method for manufacturing a metal-filled microstructure in which metal filling defects in a plurality of pores are suppressed when the metal is filled in the plurality of pores. The method for manufacturing a metal-filled microstructure comprises: a step of providing an insulating film having a plurality of pores on the surface of a metal member to obtain a structure having the metal member and the insulating film, and a plating step of performing metal plating on the surface of the structure at least on the side having the insulating film in a supercritical state or a subcritical state and filling the plurality of pores with a metal. At the start of the plating step, a metal layer other than a valve metal is present at the bottom of the pores of the structure, and the metal layer other than the valve metal is formed on a region of 80% or more of the area of the bottom of the pores.
Inventors:
KASUYA YUICHI (JP)
Application Number:
PCT/JP2020/048124
Publication Date:
August 05, 2021
Filing Date:
December 23, 2020
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
C23C28/00; C25D5/00; C25D11/04; C25D11/18; C25D11/20
Foreign References:
| JP2007214464A | 2007-08-23 | |||
| JP4163728B2 | 2008-10-08 | |||
| JP2008305443A | 2008-12-18 | |||
| US20100236596A1 | 2010-09-23 |
Attorney, Agent or Firm:
ITOH Hideaki et al. (JP)
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