Title:
METHOD FOR MANUFACTURING MICROPHONE PACKAGE
Document Type and Number:
WIPO Patent Application WO/2015/072616
Kind Code:
A1
Abstract:
Disclosed is a method for manufacturing a microphone package. The method for manufacturing a microphone package according to the present invention comprises the steps of: preparing a substrate having an upper surface on which a mounting pad is formed and a lower surface on which an input-output pad is formed; mounting a transducer on the mounting pad; preparing a cover; forming a plurality of micro-holes in the cover; coupling the cover to the substrate; and forming a water-repellent coating layer on at least a portion of the outer surface of the cover, including the peripheries of the micro-holes.
Inventors:
KIM TAE WON (KR)
CHOI JI WON (KR)
OH JUN HYEOK (KR)
CHOI JI WON (KR)
OH JUN HYEOK (KR)
Application Number:
PCT/KR2013/011276
Publication Date:
May 21, 2015
Filing Date:
December 06, 2013
Export Citation:
Assignee:
PARTRON CO LTD (KR)
International Classes:
H04R31/00; H04R19/04
Foreign References:
| JP2007037069A | 2007-02-08 | |||
| JP2009260573A | 2009-11-05 | |||
| US20080247572A1 | 2008-10-09 | |||
| JP2006174005A | 2006-06-29 | |||
| JP2006222641A | 2006-08-24 |
Attorney, Agent or Firm:
CHOI, HAK HYUN (KR)
최학현 (KR)
최학현 (KR)
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