Title:
METHOD FOR MANUFACTURING NOZZLE PLATE
Document Type and Number:
WIPO Patent Application WO/2024/063030
Kind Code:
A1
Abstract:
This method for manufacturing a nozzle plate 110 comprises: a first step for forming a first hole 305 that is longer in the [100] direction as compared with in the [010] direction and that is connected to a first surface Bb of a monocrystalline silicon substrate B in which the surface crystal orientation is in the (100) plane, and a second hole 306 that is connectable to the first hole 305 and to a second surface Ba of the monocrystalline silicon substrate B; and a second step for enlarging the first hole 305 and the second hole 306 by performing anisotropic wet etching on the monocrystalline silicon substrate B to form a nozzle flow path 100 that comprises a nozzle taper portion 20 having the (111) plane and a straight connecting portion 10 contiguous to the nozzle taper portion 20.
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Inventors:
YOKOYAMA MITSURU (JP)
SAMESHIMA KOUICHI (JP)
SAMESHIMA KOUICHI (JP)
Application Number:
PCT/JP2023/033794
Publication Date:
March 28, 2024
Filing Date:
September 15, 2023
Export Citation:
Assignee:
KONICA MINOLTA INC (JP)
International Classes:
B41J2/16; B41J2/14
Domestic Patent References:
| WO2023008375A1 | 2023-02-02 |
Foreign References:
| JP2008307838A | 2008-12-25 | |||
| JPH1067115A | 1998-03-10 | |||
| JP2014113822A | 2014-06-26 | |||
| JP2018094860A | 2018-06-21 | |||
| JP2020082503A | 2020-06-04 | |||
| JP2002321356A | 2002-11-05 | |||
| US20130135392A1 | 2013-05-30 |
Attorney, Agent or Firm:
KOYO INTERNATIONAL PATENT FIRM (JP)
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