Title:
METHOD FOR MANUFACTURING PCB CONNECTOR
Document Type and Number:
WIPO Patent Application WO/2015/163301
Kind Code:
A1
Abstract:
Connector pins (2) that have a Sn-plated film (4) on the surface of a core material (40) that comprises a Cu-Fe-based alloy are prepared, and the connector pins (2) are then press-fitted into a housing (3). Subsequently, for the connector pins (2), bent portions (22) are formed by bending exposed parts (21) that are exposed outside the housing (3). In addition, the process of heating the bent portions (22) and melting the Sn-plated films (4) is carried out at the same time as, or after, the bending to create a PCB connector.
Inventors:
SATOU MIKIO (JP)
Application Number:
PCT/JP2015/062045
Publication Date:
October 29, 2015
Filing Date:
April 21, 2015
Export Citation:
Assignee:
AUTONETWORKS TECHNOLOGIES LTD (JP)
SUMITOMO WIRING SYSTEMS (JP)
SUMITOMO ELECTRIC INDUSTRIES (JP)
SUMITOMO WIRING SYSTEMS (JP)
SUMITOMO ELECTRIC INDUSTRIES (JP)
International Classes:
H01R43/00; C22C9/00; C22C38/00; C22C38/16; C22F1/08; H01R13/03; C22F1/00
Foreign References:
| JP2013218945A | 2013-10-24 | |||
| JP2010144252A | 2010-07-01 | |||
| JP2003293187A | 2003-10-15 | |||
| JP2001203020A | 2001-07-27 | |||
| JPH05125468A | 1993-05-21 |
Attorney, Agent or Firm:
AICHI, Takahashi, Iwakura & Associates (JP)
Patent business corporation あいち international patent firm (JP)
Patent business corporation あいち international patent firm (JP)
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