Title:
METHOD OF MANUFACTURING PRINTED WIRING BOARD WITH SURFACE-MOUNT COMPONENT MOUNTED THEREON
Document Type and Number:
WIPO Patent Application WO/2010/018679
Kind Code:
A1
Abstract:
A method of manufacturing a printed wiring board (107) on which a surface-mount component (100) is mounted. The surface-mount component includes a plurality of electrodes (100a, 100b). The printed wiring board includes a plurality of lands (103, 103a, 103b). The lands are provided correspondingly to the electrodes. Each of the lands is soldered to the corresponding electrode. The manufacturing method includes a step of applying solder (104a, 104b) to the printed wiring board, a step of mounting the surface-mount component on the printed wiring board after the application of the solders, a step of detecting an inferior electrode such that the adhesion with the land by the surface tension of the molten solder is weaker than that between the other electrodes and the corresponding lands, and a step of shining a light beam so that the solder on the side for the detected inferior electrode can melt faster than the solder for the other superior electrodes. By the method, it is possible to prevent the inferior electrode from separating from the land.
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Inventors:
KONDOU YUTAKA (JP)
FUJITA HIROAKI (JP)
FUJITA HIROAKI (JP)
Application Number:
PCT/JP2009/003821
Publication Date:
February 18, 2010
Filing Date:
August 07, 2009
Export Citation:
Assignee:
YAMAHA MOTOR CO LTD (JP)
KONDOU YUTAKA (JP)
FUJITA HIROAKI (JP)
KONDOU YUTAKA (JP)
FUJITA HIROAKI (JP)
International Classes:
H05K3/34; B23K1/00; B23K1/005; B23K101/42
Foreign References:
| JP2006324424A | 2006-11-30 | |||
| JP2008166489A | 2008-07-17 |
Attorney, Agent or Firm:
UEBA, Hidetoshi et al. (JP)
Hidetoshi Ueha (JP)
Hidetoshi Ueha (JP)
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