Title:
METHOD FOR MANUFACTURING PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2020/196105
Kind Code:
A1
Abstract:
Provided is a method for manufacturing a printed wiring board which effectively suppresses pattern errors and has superior fine circuit forming properties. This method for manufacturing a printed wiring board includes a step for preparing an insulated substrate provided with a rough surface; a step for forming an electroless plating layer, less than 1.0 µm thick, having a surface in which the rough surface of the insulated substrate is subjected to electroless plating and which has an arithmetic mean waviness Wa of 0.10-0.25 µm, inclusive, as measured in compliance with JIS B0601-2001 and a kurtosis Sku of 2.0-3.5, inclusive, as measured in compliance with ISO 25178; a step for laminating a photoresist onto the surface of the electroless plating layer; a step for forming a resist pattern by exposure and development; a step for electroplating the electroless plating layer; a step for peeling the resist pattern off; and a step for forming a wiring pattern by using etching to remove unneeded portions of the electroless plating layer.
Inventors:
SHIMIZU YOSHINORI (JP)
IIDA HIROTO (JP)
MIZOGUCHI MISATO (JP)
TAKANASHI AKITOSHI (JP)
HOSOKAWA MAKOTO (JP)
IIDA HIROTO (JP)
MIZOGUCHI MISATO (JP)
TAKANASHI AKITOSHI (JP)
HOSOKAWA MAKOTO (JP)
Application Number:
PCT/JP2020/011791
Publication Date:
October 01, 2020
Filing Date:
March 17, 2020
Export Citation:
Assignee:
MITSUI MINING & SMELTING CO (JP)
International Classes:
H05K3/18
Domestic Patent References:
| WO2016158775A1 | 2016-10-06 |
Foreign References:
| JP2012033642A | 2012-02-16 |
Attorney, Agent or Firm:
TAKAMURA Masaharu et al. (JP)
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