Title:
METHOD OF MANUFACTURING PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2020/196106
Kind Code:
A1
Abstract:
Provided is a method of manufacturing a printed wiring board, which effectively suppresses pattern defects and has excellent fine circuit formability. This method of manufacturing a printed wiring board comprises: a step for preparing an insulation base material having a roughened surface; a step for performing electroless plating on the roughened surface of the insulation base material and forming an electroless plating layer having a thickness of less than 1.0 μm and having a surface of which an arithmetic mean waviness Wa is 0.10-0.25 μm as measured according to JIS B0601-2001 and a void volume Vvv of a valley portion is 0.010 μm3/μm2-0.028 μm3/μm2 as measured according to ISO25178; a step for laminating a photoresist on the surface of the electroless plating layer; a step for forming a resist pattern by performing exposure and development; a step for performing electroless plating on the electroless plating layer; a step or peeling the resist pattern; and a step for forming a wiring pattern by removing a unnecessary part of the electroless plating layer through etching.
Inventors:
SHIMIZU YOSHINORI (JP)
IIDA HIROTO (JP)
MIZOGUCHI MISATO (JP)
TAKANASHI AKITOSHI (JP)
HOSOKAWA MAKOTO (JP)
IIDA HIROTO (JP)
MIZOGUCHI MISATO (JP)
TAKANASHI AKITOSHI (JP)
HOSOKAWA MAKOTO (JP)
Application Number:
PCT/JP2020/011792
Publication Date:
October 01, 2020
Filing Date:
March 17, 2020
Export Citation:
Assignee:
MITSUI MINING & SMELTING CO (JP)
International Classes:
H05K3/18
Domestic Patent References:
| WO2016158775A1 | 2016-10-06 |
Foreign References:
| JP2012033642A | 2012-02-16 | |||
| JP2017038043A | 2017-02-16 |
Attorney, Agent or Firm:
TAKAMURA Masaharu et al. (JP)
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