Title:
METHOD FOR MANUFACTURING PRINTED WIRING BOARD WITH METAL REINFORCEMENT PLATE, MEMBER SET, AND PRINTED WIRING BOARD WITH METAL REINFORCEMENT PLATE
Document Type and Number:
WIPO Patent Application WO/2022/239167
Kind Code:
A1
Abstract:
This method for manufacturing a printed wiring board with a metal reinforcement plate comprises: a step [1] in which a member set (17) is disposed on a printed wiring board (20) so that the wiring board (20) and a conductive adhesive (12) oppose each other, the member set being provided with, in the given order, a metal reinforcement plate (14), a cushion material (16), and the conductive adhesive (12) which contains a conductive filler and a binder resin that is softened by heat; a step [2] for hot-pressing the member set (17) so that a ground circuit (25) and the metal reinforcement plate (14) are adhered by the conductive adhesive (12) via an opening (27) provided to an insulating protective film (22, 23), and the ground circuit (25) and the metal reinforcement plate (14) are electrically connected; and a step [3] for peeling off the cushion material (16) of the member set (17).
Inventors:
NISHINOHARA SATOSHI (JP)
HAYASAKA TSUTOMU (JP)
HAYASAKA TSUTOMU (JP)
Application Number:
PCT/JP2021/018129
Publication Date:
November 17, 2022
Filing Date:
May 12, 2021
Export Citation:
Assignee:
TOYO INK SC HOLDINGS CO LTD (JP)
TOYOCHEM CO LTD (JP)
TOYOCHEM CO LTD (JP)
International Classes:
H05K9/00; H05K1/02; H05K3/32
Domestic Patent References:
| WO2016032006A1 | 2016-03-03 |
Foreign References:
| JP2000013031A | 2000-01-14 | |||
| JP2005154977A | 2005-06-16 | |||
| JP2018168323A | 2018-11-01 | |||
| JP2021097152A | 2021-06-24 |
Attorney, Agent or Firm:
IEIRI Takeshi (JP)
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