METHOD FOR MANUFACTURING RESIN-SEALED ELECTRONIC COMPONENT AND DEVICE FOR MANUFACTURING RESIN-SEALED ELECTRONIC COMPONENT

WIPO Patent Application WO/2013/132693

A1

Provided are a method for manufacturing a resin-sealed electronic component and a device for manufacturing a resin-sealed electronic component, in which a resin-sealed electronic component having a plate-shaped member can be manufactured in a simple manner and at low cost. A method for manufacturing a resin-sealed electronic component in which an electronic component is resin-sealed, wherein the resin-sealed electronic component has a plate-shaped member (13), and the method for manufacturing is characterized in including: a resin placement step (d) for placing a resin (15) on the plate-shaped member (13); transportation steps (e)-(h) for transporting the resin (15) to the position of a mold cavity (17a) of the forming mold in a state of having been placed on the plate-shaped member (13); and a resin-sealing step for compression molding the resin (15) with the plate-shaped member (13) and the electronic component in the mold cavity (17a) in a state in which the electronic component is immersed in the resin (15) placed on the plate-shaped member (13), and thereby resin-sealing the electronic component.

URAGAMI HIROSHI (JP)
MIZUMA KEITA (JP)
OKAMOTO ICHITARO (JP)
TAKADA NAOKI (JP)
NAKAMURA MAMORU (JP)
YASUDA SHINSUKE (JP)

PCT/JP2012/078996

September 12, 2013

November 08, 2012

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TOWA CORP (JP)

H01L21/56; B29C43/18

JP2011187877A	2011-09-22
JP2011054806A	2011-03-17
JPH1079362A	1998-03-24

TSUJIMARU Koichiro et al. (JP)
Koichiro Tsujimaru (JP)

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