METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND COMPRESSION MOLDING DEVICE

WIPO Patent Application WO/2006/100765

A1

A method of manufacturing a semiconductor device, comprising the steps of preparing a substrate (wiring board), mounting a chip on the substrate, mounting the substrate on the lower surface of a cope for compression molding, throwing a powder resin into a cavity in the upper surface of a drag, and molding a sealed body on the lower surface of the substrate by mold clamping. The drag comprises the cavity corresponding to the sealed body molded on the substrate, a flow cavity positioned on the outside of the cavity, a plurality of flow gates allowing the cavity to communicate with the flow cavity, and a plurality of air vents arranged continuously with the cavity. The cope comprises a holding mechanism holding the substrate and a flow cavity plunger controllably plunged into the flow cavity of the drag. The method is characterized in that, when the sealed body is molded, the pressuring force of the resin flowing into the flow cavity is brought to the same pressure as the pressuring force of the resin in the cavity by plunging the flow cavity plunger into the flow cavity before the sealed body is molded.

KURATOMI BUNSHI (JP)
NISHITA TAKAFUMI (JP)
SHIMIZU FUKUMI (JP)

PCT/JP2005/005243

September 28, 2006

March 23, 2005

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RENESAS TECH CORP (JP)
KURATOMI BUNSHI (JP)
NISHITA TAKAFUMI (JP)
SHIMIZU FUKUMI (JP)

H01L21/56

JP2004017322A	2004-01-22
JP2005032910A	2005-02-03

HIROSHI FUKUORA: "Sentan Package-yo Asshuki Seikei Sochi", DENSHI ZAIRYO, vol. 43, no. 8, 2004, KOGYO CHOSAKAI PUBLISHIG CO. LTD., pages 66 - 69, XP003008780

Akita, Shuki (Twintabata Bldg. B 13-9, Higashi-Tabata 1-chom, Kita-ku Tokyo, JP)

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