Title:
METHOD FOR MANUFACTURING SENSOR CHIP
Document Type and Number:
WIPO Patent Application WO/2014/109327
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a method for manufacturing a sensor chip for fluorescence measurement, the method enabling a higher degree of freedom of selection of a material for a substrate (particularly, a dielectric member) of the sensor chip, and a higher productivity by reducing the number of steps until a water-soluble polymer for immobilizing a ligand such as an antibody is immobilized on a substrate. A method for manufacturing a sensor chip for fluorescence measurement comprises: a step for forming a metal film on the surface of a transparent support; and a step for covering the metal film on the transparent support with an aqueous solution of a water-soluble polymer compound represented by following formula (1), and bonding the sugar chain compound to the metal film.
X-L1-Y-L2 … (1)
(where X is a functional group that can be bonded to metal, L1 is a hydrocarbon chain that may be interrupted by a hetero atom, L2 is a water-soluble polymer, and Y is a point of bonding with the water-soluble polymer L2)
Inventors:
WADA TAKESHI (JP)
Application Number:
PCT/JP2014/050131
Publication Date:
July 17, 2014
Filing Date:
January 08, 2014
Export Citation:
Assignee:
KONICA MINOLTA INC (JP)
International Classes:
G01N21/64; G01N33/543; G01N33/553
Domestic Patent References:
| WO2011096394A1 | 2011-08-11 |
Foreign References:
| JP2007256268A | 2007-10-04 | |||
| JP2008522164A | 2008-06-26 | |||
| JP2009530639A | 2009-08-27 |
Attorney, Agent or Firm:
SSINPAT PATENT FIRM (JP)
Patent business corporation SSINPAT (JP)
Patent business corporation SSINPAT (JP)
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