Title:
METHOD FOR MANUFACTURING STRUCTURE FOR BONDING TERMINAL AND WIRE ROD, AND STRUCTURE FOR BONDING TERMINAL AND WIRE ROD
Document Type and Number:
WIPO Patent Application WO/2010/134221
Kind Code:
A1
Abstract:
Provided is a structure for firmly bonding a terminal and a wire rod. A method for manufacturing the structure for bonding a terminal and a wire rod is also provided so as to form the bonding structure by welding the terminal and the wire rod. The method for manufacturing the bonding structure is provided with (a) a step of making a wire rod abut on a position regulating surface section in a posture where the axial direction of the wire rod is in the thickness direction of a terminal, and supporting the wire rod at a position spaced apart from a protruding section, and (b) a step of bonding the terminal and the wire rod with each other by melting at least an leading end side portion of the protruding section.
Inventors:
KIKUCHI YUSUKE (JP)
OISHI AKINORI (JP)
HATTORI AKIRA (JP)
HATTORI MITSUHIRO (JP)
OISHI AKINORI (JP)
HATTORI AKIRA (JP)
HATTORI MITSUHIRO (JP)
Application Number:
PCT/JP2009/067386
Publication Date:
November 25, 2010
Filing Date:
October 06, 2009
Export Citation:
Assignee:
SUMITOMO WIRING SYSTEMS (JP)
KIKUCHI YUSUKE (JP)
OISHI AKINORI (JP)
HATTORI AKIRA (JP)
HATTORI MITSUHIRO (JP)
KIKUCHI YUSUKE (JP)
OISHI AKINORI (JP)
HATTORI AKIRA (JP)
HATTORI MITSUHIRO (JP)
International Classes:
H01R43/02; B23K26/00; B23K26/21; H01R4/02
Foreign References:
| JP2006140737A | 2006-06-01 | |||
| JP2008519692A | 2008-06-12 | |||
| JPS5540069A | 1980-03-21 |
Attorney, Agent or Firm:
YOSHITAKE Hidetoshi et al. (JP)
Hidetoshi Yoshitake (JP)
Hidetoshi Yoshitake (JP)
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Claims: