Title:
METHOD FOR MANUFACTURING SUBSTRATE WITH WIRING ELECTRODE
Document Type and Number:
WIPO Patent Application WO/2024/004318
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a method for manufacturing a substrate with a wiring electrode, wherein an opaque wiring electrode pattern is not easily visible, and processability is excellent. The present invention relates to a method for manufacturing a substrate with a wiring electrode, the method comprising: a step for forming an opaque wiring electrode pattern on at least one surface of a transparent substrate; a step for forming a light-shielding layer on the opaque wiring electrode pattern-formed surface of the transparent substrate by transferring a positive photosensitive resin layer that contains light-shielding components; and a step for forming a light-shielding pattern on a region corresponding to the opaque wiring electrode pattern by exposing and developing the light-shielding layer by using the opaque wiring electrode pattern as a mask.
Inventors:
IKEDA RYUTARO (JP)
TAKASE KOHEI (JP)
KINOSHITA HIDEKI (JP)
TAKASE KOHEI (JP)
KINOSHITA HIDEKI (JP)
Application Number:
PCT/JP2023/014494
Publication Date:
January 04, 2024
Filing Date:
April 10, 2023
Export Citation:
Assignee:
TORAY INDUSTRIES (JP)
International Classes:
G03F7/004; G03F7/023; G06F3/041; G06F3/044; H05K3/00
Domestic Patent References:
| WO2018168325A1 | 2018-09-20 | |||
| WO2018061506A1 | 2018-04-05 |
Foreign References:
| JP2021162666A | 2021-10-11 | |||
| JP2000200960A | 2000-07-18 | |||
| JPH0862617A | 1996-03-08 |
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