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Patent Searching and Data


Title:
METHOD FOR MANUFACTURING SUPERCONDUCTING WIRE MATERIAL, AND SUPERCONDUCTING WIRE MATERIAL
Document Type and Number:
WIPO Patent Application WO/2013/114588
Kind Code:
A1
Abstract:
Provided are a method for manufacturing a superconducting wire material in which the superconducting current is not saturated even when a superconducting layer is made into a thick film, and a superconducting wire material. A method for manufacturing a superconducting wire material (1) in which a superconducting layer (13) is formed on a metal substrate (11) interposed by an intermediate layer (12), wherein the method for manufacturing the superconducting wire material is characterized in including a heating step for heating the metal substrate (11) up to the film-formation temperature of a superconducting film for forming the superconducting layer (13), a film-formation step for forming a superconducting film having a film thickness of at least 10 nm and no more than 200 nm on the intermediate layer (12), and a cooling step for reducing the metal substrate (11) temperature to a level below the film-formation temperature of the superconducting film, the method also being characterized in that the superconducting film-formation steps, comprising the heating step, the film-formation step, and the cooling step, are performed a plurality of times.

Inventors:
NAKASAKI RYUSUKE (JP)
NAKAI AKINOBU (JP)
WATANABE TOMONORI (JP)
KASHIMA NAOJI (JP)
NAGAYA SHIGEO (JP)
Application Number:
PCT/JP2012/052274
Publication Date:
August 08, 2013
Filing Date:
February 01, 2012
Export Citation:
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Assignee:
FURUKAWA ELECTRIC CO LTD (JP)
CHUBU ELECTRIC POWER (JP)
NAKASAKI RYUSUKE (JP)
NAKAI AKINOBU (JP)
WATANABE TOMONORI (JP)
KASHIMA NAOJI (JP)
NAGAYA SHIGEO (JP)
International Classes:
H01B12/06
Foreign References:
JP2011060769A2011-03-24
JPH02279597A1990-11-15
JP2006233266A2006-09-07
JP2004536218A2004-12-02
Other References:
See also references of EP 2800106A4
Attorney, Agent or Firm:
ARAFUNE, Hiroshi et al. (JP)
Hiroshi Arafune (JP)
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Claims: