METHOD FOR MANUFACTURING WIRING BOARD OR WIRING BOARD MATERIAL

Title:

METHOD FOR MANUFACTURING WIRING BOARD OR WIRING BOARD MATERIAL

Document Type and Number:

WIPO Patent Application WO/2017/145936

Kind Code:

A1

Abstract:

Provided are a method for manufacturing a wiring board or a wiring board material, and a resultant wiring board. The method allows columnar metal members to be inserted into the wiring board at once using a simple operation, enables alignment without requiring strict accuracy, can handle columnar metal members of different shapes, and imparts sufficiently high adhesive strength to the columnar metal members. The method comprises: a step in which a support sheet 10 on which columnar metal members 14 have been formed, and a laminate material LM including a wiring board WB or a wiring board material WB' having a plurality of openings in portions corresponding to the columnar metal members 14, and a prepreg 16' having a plurality of openings and containing a thermosetting resin are laminated such that the columnar metal members 14 are positioned in the respective openings; a step of obtaining a laminate LB by integrating the laminate material LM by heating and pressing, the laminate LB having a thermosetting resin 17 filling gaps between an inner surface of the openings of the wiring board WB or the wiring board material WB' and the columnar metal members 14; and a step of peeling at least the support sheet 10 from the laminate LB.

Inventors:

YOSHIMURA EIJI (JP)

Application Number:

PCT/JP2017/005924

Publication Date:

August 31, 2017

Filing Date:

February 17, 2017

Export Citation:

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Assignee:

DAIWA CORP (JP)

International Classes:

H05K3/40; H01L23/12; H01L23/36; H05K1/11

Foreign References:

JP2005051088A	2005-02-24
JP2010062199A	2010-03-18
JP2004179309A	2004-06-24
JP2011159727A	2011-08-18
JP2006156610A	2006-06-15

Other References: