Title:
METHOD FOR MANUFACTURING WIRING CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2022/230910
Kind Code:
A1
Abstract:
This method for manufacturing a wiring circuit board comprises: a step for forming an insulating layer atop an elongated metal support substrate by means of a roll-to-roll process; and a step for forming a plating resist layer, which includes a photosensitive material, atop the insulating layer by means of the roll-to-roll process. In addition, this method for manufacturing a wiring circuit board comprises: a step for exposing the plating resist layer using a prescribed pattern by means of the roll-to-roll process; a step for developing the plating resist layer exposed using the prescribed pattern by means of the roll-to-roll process, and thereby forming, in the plating resist layer, an opening having the prescribed pattern or an opposite pattern to the prescribed pattern; and a step for forming a conductor layer inside the opening by means of the roll-to-roll process. The step for forming the plating resist layer includes applying a photosensitive resist liquid on the insulating layer and then performing a heat treatment on the liquid film of the applied resist liquid.
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Inventors:
KUWAYAMA HIRONORI (JP)
TANAKA SHINGO (JP)
TANAKA SHINGO (JP)
Application Number:
PCT/JP2022/018986
Publication Date:
November 03, 2022
Filing Date:
April 26, 2022
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
H05K3/18
Foreign References:
| JPH10320736A | 1998-12-04 | |||
| JP2000290406A | 2000-10-17 | |||
| JPH07261388A | 1995-10-13 | |||
| JPH1117059A | 1999-01-22 | |||
| JPH01253728A | 1989-10-11 | |||
| JPS52143769A | 1977-11-30 |
Attorney, Agent or Firm:
NAKAGAWA, Masahiro et al. (JP)
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