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Patent Searching and Data


Title:
THREE-DIMENSIONAL MOLDING CURED MATERIAL
Document Type and Number:
WIPO Patent Application WO/2022/230911
Kind Code:
A1
Abstract:
The present invention is a three-dimensionally moldable cured material which controls hardness after solidification, has excellent bondability with surface materials and aggregates, and has excellent flexibility and can be bent freely after curing, that is, a three-dimensional molding cured material that can be obtained by mixing a specific curing agent B (curing agent B being calcium hydroxide, sodium hydrogen carbonate, alum, magnesium chloride, etc.) into a main agent A containing an aqueous resin emulsion, an extender, and a dispersant, the curing agent B being in an amount of 2-20 parts by mass with respect to 100 parts by mass of the main agent A.

Inventors:
UESAKA SUSUMU (JP)
Application Number:
PCT/JP2022/018993
Publication Date:
November 03, 2022
Filing Date:
April 18, 2022
Export Citation:
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Assignee:
UESAKA SUSUMU (JP)
International Classes:
C09D5/02; B33Y70/00; C08K3/00; C08L33/02; C08L101/00; C09D5/06; C09D7/40; C09D7/61; C09D7/65; C09D201/00
Foreign References:
JP2020063403A2020-04-23
JP2005272766A2005-10-06
JPH04202380A1992-07-23
JP2001031829A2001-02-06
JP2006330412A2006-12-07
JP2000219804A2000-08-08
JP2001234081A2001-08-28
JPH01285982A1989-11-16
JP2007177563A2007-07-12
JPS552613U1980-01-09
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