METHOD OF MEASURING CONTACT STRESS OF CONTACTING SOLID SURFACES WITH ULTRASONIC WAVES

Title:

METHOD OF MEASURING CONTACT STRESS OF CONTACTING SOLID SURFACES WITH ULTRASONIC WAVES

Document Type and Number:

WIPO Patent Application WO/1983/003470

Kind Code:

A1

Abstract:

Method of measuring the contact stress at the contacting surface (4) of solids of the same or different type by utilizing ultrasonic waves, which comprises the steps of introducing the ultrasonic waves into the contacting surfaces (4), comparing the sound pressure of the waves reflected from the contacting surface (4) with that of waves transmitted through the contacting surface (4), and measuring the contact stress using the compared value as an evaluation index, thereby simply, non-destructively, quantitatively and accurately measuring the contact stress of the contacting surfaces of parts or members forming a machine or the like in static and dynamic states.

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Inventors:

OGURA YUKIO (JP)
MIYAJIMA TAKESHI (JP)

Application Number:

PCT/JP1982/000087

Publication Date:

October 13, 1983

Filing Date:

March 30, 1982

Export Citation:

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Assignee:

HITACHI CONSTRUCTION MACHINERY (JP)

International Classes:

G01L1/25; G01N29/04; (IPC1-7): G01L5/00; G01N29/04

Foreign References:

JPS4812082A
US4132117A	1979-01-02
JPS53143292A	1978-12-13
JPS5394989A	1978-08-19
JPS4934879A	1974-03-30
US3063290A	1962-11-13
JPS56129855A	1981-10-12
JPS4214634Y1	1967-08-21

Other References: