Title:
METHOD FOR MOUNTING ELECTRONIC COMPONENT AND PARTIAL SHIELD SUBSTRATE FOR ELECTRONIC COMPONENT MOUNTING
Document Type and Number:
WIPO Patent Application WO/2023/286426
Kind Code:
A1
Abstract:
This method for mounting electronic components includes a substrate for electronic component mounting, which has a base material, a plurality of solder parts on the base material, and a plurality of electronic components arranged in contact with the plurality of solder parts in correspondence with the plurality of solder parts, being irradiated with microwaves while an electromagnetic wave shield is applied to some of the plurality of solder parts, and at least a solder part to which the electromagnetic wave shield is not applied being heated and melted by the action of the magnetic field of a standing wave formed by the microwave irradiation.
Inventors:
UEMURA SEI (JP)
NAKAMURA TAKASHI (JP)
NISHIOKA MASATERU (JP)
UENO NAOKO (JP)
NAKAMURA TAKASHI (JP)
NISHIOKA MASATERU (JP)
UENO NAOKO (JP)
Application Number:
PCT/JP2022/019387
Publication Date:
January 19, 2023
Filing Date:
April 28, 2022
Export Citation:
Assignee:
AIST (JP)
International Classes:
H05K3/34; H05B6/74; H05B6/80; H05K9/00
Foreign References:
| JP2021061412A | 2021-04-15 | |||
| JP2019136771A | 2019-08-22 | |||
| JP2013171863A | 2013-09-02 | |||
| JP2002158436A | 2002-05-31 | |||
| JPH0738992U | 1995-07-14 |
Attorney, Agent or Firm:
IIDA & PARTNERS et al. (JP)
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