Title:
SUBSTRATE HOLDING DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/286427
Kind Code:
A1
Abstract:
Provided is a substrate holding device capable of smoothly discharging assist gas without deteriorating a function of improving sealing between an annular wall and a process-target substrate. This substrate holding device SH comprises: a susceptor 6 in which a first annular wall 61 in contact with the outer circumferential part of a process-target substrate Sw and a second annular wall 62 disposed inward of the first annular wall are protruded; a surface pressure applying means 51 for applying surface pressure, toward the first and second annular walls, to the process-target substrate in contact with the first and second annular walls; and gas introduction means 71, 72, 71a, 72a for introducing a predetermined gas to an outward space 63 that is in the susceptor and that is partitioned by the process-target substrate and the first and second annular walls, and to an inward space 64 that is in the susceptor and that is partitioned by the process-target substrate and the second annular wall, to cause the respective outward and inward spaces to be in a gas atmosphere. At the second annular wall, a connecting path 62a is formed so as to connect the outward space and the inward space with each other, and has a conductance value at which the gas atmosphere can be separated between the outward space and the inward space.
Inventors:
TAKAHASHI TEPPEI (JP)
SAKAUE HIROTOSHI (JP)
MAEHIRA KEN (JP)
SAKAUE HIROTOSHI (JP)
MAEHIRA KEN (JP)
Application Number:
PCT/JP2022/019727
Publication Date:
January 19, 2023
Filing Date:
May 09, 2022
Export Citation:
Assignee:
ULVAC INC (JP)
International Classes:
H01L21/683; C23C14/50
Foreign References:
| JP2014041903A | 2014-03-06 | |||
| JP2002141332A | 2002-05-17 | |||
| JPH09283608A | 1997-10-31 | |||
| JP2020102619A | 2020-07-02 |
Attorney, Agent or Firm:
SEIGA IP CORPORATION (JP)
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