Title:
METHOD FOR POLISHING GLASS SUBSTRATE, METHOD FOR PRODUCING GLASS SUBSTRATE, METHOD FOR PRODUCING GLASS SUBSTRATE FOR MAGNETIC DISKS, METHOD FOR PRODUCING MAGNETIC DISK, POLISHING LIQUID AND METHOD FOR REDUCING CERIUM OXIDE
Document Type and Number:
WIPO Patent Application WO/2018/097261
Kind Code:
A1
Abstract:
The present invention provides a method for polishing a glass substrate, which is capable of maintaining a polishing rate that is higher than ever before for a long period of time in a glass substrate polishing process wherein cerium oxide is used as polishing abrasive grains. According to the present invention, a glass substrate is polished by supplying a polishing liquid, which contains cerium oxide as polishing abrasive grains, to a polishing surface of the glass substrate. This polishing liquid contains cerium oxide as polishing abrasive grains, and additionally contains a substance that reduces cerium oxide when irradiated with light. The polishing liquid is irradiated with light during the polishing process.
Inventors:
NAKAGAWA HIROKI (JP)
NAKAYAMA KASHIO (JP)
NAKAYAMA KASHIO (JP)
Application Number:
PCT/JP2017/042278
Publication Date:
May 31, 2018
Filing Date:
November 24, 2017
Export Citation:
Assignee:
HOYA CORP (JP)
International Classes:
G11B5/84; C09G1/02; C09K3/14
Domestic Patent References:
| WO2012165376A1 | 2012-12-06 |
Foreign References:
| JP2009215093A | 2009-09-24 | |||
| JP2009087441A | 2009-04-23 |
Attorney, Agent or Firm:
OTSUKA Takefumi (JP)
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