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Patent Searching and Data


Title:
METHOD FOR PREDICTING DEFORMING OR RESIDUAL STRESS, AND PROGRAM
Document Type and Number:
WIPO Patent Application WO/2023/195454
Kind Code:
A1
Abstract:
The present invention provides a prediction method (correction thermal shrinkage method) with which it is possible to accurately predict, in a short time, deforming or residual stress occurring due to a heated object returning to normal temperature. A prediction method according to the present invention includes predicting deforming or residual stress occurring due to a heated object returning to normal temperature, the prediction method being characterized by including: a condition-setting step for setting a first shrinkage region and a second shrinkage region in a model for analyzing the object, and setting a first temperature change amount in the first shrinkage region and a second temperature change amount in the second shrinkage region; and an analysis step for imparting a first shrinkage strain calculated from the first temperature change amount to the first shrinkage region, and imparting a second shrinkage strain calculated from the second temperature change amount to the second shrinkage region, to analyze elasticity or elastoplasticity.

Inventors:
SHIBAHARA MASAKAZU (JP)
IKUSHIMA KAZUKI (JP)
MAEDA SHINTARO (JP)
KATO TAKUYA (JP)
TEZEN TOWA (JP)
YASUDA SHOGO (JP)
LEE JIHO (JP)
Application Number:
PCT/JP2023/013846
Publication Date:
October 12, 2023
Filing Date:
April 03, 2023
Export Citation:
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Assignee:
UNIV OSAKA PUBLIC CORP (JP)
International Classes:
G01N3/00; B23K31/00; G01N3/60; G01N25/18
Foreign References:
JP2006126076A2006-05-18
JP2009048361A2009-03-05
JP2011159213A2011-08-18
Other References:
MURAKAMI HIROKI: "Construction of a simple analysis method for welding distortion by thermal shrinkage technique and research on its application to actual machines", DISSERTATION OSAKA UNIVERSITY, 1 January 2022 (2022-01-01), pages 1 - 101, XP093096111, DOI: 10.18910/88049
Attorney, Agent or Firm:
NOGAWA, Nobuhisa et al. (JP)
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