Title:
METHOD FOR PROCESSING SPUTTERING TARGET AND METHOD FOR MANUFACTURING SPUTTERING TARGET PRODUCT
Document Type and Number:
WIPO Patent Application WO/2018/151036
Kind Code:
A1
Abstract:
A method for processing a sputtering target, comprising rotating a cutting tool about an axis thereof, the cutting tool having a blade part including a concave surface that is arc-shaped in a cross-section along the axis thereof, and chamfering a corner formed by a sputtering surface and a side surface of the sputtering target through use of the concave surface of the blade part so as to approximate a desired arc-shaped rounded surface, wherein the corner of the sputtering target is chamfered so that the curvature radius Ra of the concave surface of the blade part is equal to or greater than the curvature radius Rb of the desired rounded surface and both ends of the concave surface of the blade part are separated from the sputtering target in the cross-section along the axis.
Inventors:
FUJITA MASAHIRO (JP)
Application Number:
PCT/JP2018/004578
Publication Date:
August 23, 2018
Filing Date:
February 09, 2018
Export Citation:
Assignee:
SUMITOMO CHEMICAL CO (JP)
International Classes:
B23C3/00; B23C3/12
Foreign References:
| JP2009127125A | 2009-06-11 | |||
| JP2011200958A | 2011-10-13 | |||
| JP2007070715A | 2007-03-22 | |||
| JP2010100930A | 2010-05-06 | |||
| JPS63174810A | 1988-07-19 | |||
| JPH08141893A | 1996-06-04 |
Attorney, Agent or Firm:
NAKAYAMA, Tohru et al. (JP)
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