Title:
METHOD FOR PRODUCING CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2012/147313
Kind Code:
A1
Abstract:
This method for producing a circuit board has: a step for preparing a fiber-piece-containing paste; a step for producing a filtered recovered paste; a step for producing a reuse paste; a step for pasting a protective film; a step for forming a hole; and a step for filling the hole with the reuse paste. The method further has: a step for forming a protrusion comprising the reuse paste; a step for disposing and pressing a metal foil at both surfaces of a second pre-preg; a step for heating the second pre-preg, curing the second pre-preg and the reuse paste; and a step for processing the metal foil into a circuit pattern.
Inventors:
HIMORI TSUYOSHI
KATSUMATA MASAAKI
KONDOU TOSHIKAZU
KATSUMATA MASAAKI
KONDOU TOSHIKAZU
Application Number:
PCT/JP2012/002705
Publication Date:
November 01, 2012
Filing Date:
April 19, 2012
Export Citation:
Assignee:
PANASONIC CORP (JP)
HIMORI TSUYOSHI
KATSUMATA MASAAKI
KONDOU TOSHIKAZU
HIMORI TSUYOSHI
KATSUMATA MASAAKI
KONDOU TOSHIKAZU
International Classes:
H05K3/40; H01B13/00; H05K3/46
Foreign References:
| JP2002171060A | 2002-06-14 | |||
| JPH10290072A | 1998-10-27 | |||
| JP2001287336A | 2001-10-16 | |||
| JP2000261116A | 2000-09-22 | |||
| JPH06268345A | 1994-09-22 | |||
| JP2002171060A | 2002-06-14 |
Other References:
See also references of EP 2571340A4
Attorney, Agent or Firm:
NAITO, Hiroki et al. (JP)
Hiroki Naito (JP)
Hiroki Naito (JP)
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Claims: