Title:
METHOD FOR PRODUCING CONDUCTIVE SUBSTRATE, AND CONDUCTIVE SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2020/079844
Kind Code:
A1
Abstract:
This method for producing a conductive substrate comprises: a wiring line formation step wherein a wiring line 12 is formed in a pattern on one surface of a substrate 11; a fiber arrangement step wherein conductive fibers 13 are arranged on the one surface of the substrate 11 so as to cover the wiring line 12; a resin formation step wherein a photosensitive resin layer 24 is formed on the one surface of the substrate 11, said one surface having been provided with the conductive fibers 13; and a light exposure/development step wherein a cured layer 14 of the conductive fibers 13 and the photosensitive resin layer 24 is formed in a pattern by means of light exposure and development.
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Inventors:
EBIHARA MASAHIKO (JP)
YOSHIDA HIDEKI (JP)
YOSHIHARA KENSUKE (JP)
MINAMI MASASHI (JP)
YOSHIDA HIDEKI (JP)
YOSHIHARA KENSUKE (JP)
MINAMI MASASHI (JP)
Application Number:
PCT/JP2018/039079
Publication Date:
April 23, 2020
Filing Date:
October 19, 2018
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
H05K3/02; G06F3/041; H01B5/14; H01B13/00; H05K3/06
Domestic Patent References:
| WO2014132623A1 | 2014-09-04 |
Foreign References:
| JP2017071202A | 2017-04-13 | |||
| JP2016152205A | 2016-08-22 | |||
| JP2016197554A | 2016-11-24 | |||
| JP2014063444A | 2014-04-10 | |||
| JP2009252493A | 2009-10-29 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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