Title:
METHOD FOR PRODUCING CONDUCTIVE SUBSTRATE, AND CONDUCTIVE SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2020/158494
Kind Code:
A1
Abstract:
Provided are: a method for producing a conductive substrate comprising conductive fine wires that have been fine-sized and have an excellent conductivity; and a conductive substrate. The method for producing the conductive substrate comprises a step A of forming, on a support, a silver halide-containing photosensitive layer that contains a silver halide, gelatin, and a non-gelatin polymer; a step B of exposing the silver halide-containing photosensitive layer to light and subsequently developing same to form a fine line-shaped silver-containing layer in which the width of lines containing metal gelatin and the polymer is not more than 2.0 μm; a step C of carrying out a heat treatment on the silver-containing layer provided by the step B; a step D of removing the gelatin in the silver-containing layer provided by the step C; and a step E of carrying out a plating process on the silver-containing layer provided by the step D to form conductive fine wires. In the vertical cross section of the conductive fine wires in the direction orthogonal to the direction in which the conductive fine wires extend, the width of the region in which metal is present is not more than 2.0 μm.
Inventors:
HARADA MOTOI (JP)
KATAGIRI KENSUKE (JP)
OGAWA JUNYA (JP)
KATAGIRI KENSUKE (JP)
OGAWA JUNYA (JP)
Application Number:
PCT/JP2020/001843
Publication Date:
August 06, 2020
Filing Date:
January 21, 2020
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
B32B3/14; B32B7/025; G03F7/004; G03F7/40; G06F3/044; H01B5/14; H01B13/00; H05K3/02; H05K3/24
Domestic Patent References:
| WO2017017973A1 | 2017-02-02 |
Foreign References:
| JP2014209332A | 2014-11-06 | |||
| US20080199665A1 | 2008-08-21 | |||
| JP2012234695A | 2012-11-29 |
Attorney, Agent or Firm:
NAKASHIMA Junko et al. (JP)
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