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Patent Searching and Data


Title:
EPOXY RESIN SOLUTION
Document Type and Number:
WIPO Patent Application WO/2020/158493
Kind Code:
A1
Abstract:
The present invention provides an epoxy resin solution whereby an epoxy resin cured material having sufficiently superior heat resistance and dielectric characteristics can be obtained with sufficiently favorable working efficiency. The present invention relates to an epoxy resin solution obtained by mixing at least a curing agent and an epoxy resin with an organic solvent, the curing agent including an imide-group-containing curing agent having 1-4 imide groups and 2-4 glycidyl-group-reactive functional groups in the molecule thereof.

Inventors:
YANAKA AYUMI (JP)
FUKUBAYASHI YUMETO (JP)
MURAKAMI TAKATOSHI (JP)
Application Number:
PCT/JP2020/001838
Publication Date:
August 06, 2020
Filing Date:
January 21, 2020
Export Citation:
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Assignee:
UNITIKA LTD (JP)
International Classes:
C08G59/42; C08G73/10; C08J5/24
Domestic Patent References:
WO2018139559A12018-08-02
WO2019188436A12019-10-03
Foreign References:
JPH11130859A1999-05-18
JPS6229584A1987-02-07
JP2013237844A2013-11-28
JP2012111930A2012-06-14
JP2012006992A2012-01-12
JP2012025894A2012-02-09
JP2006307091A2006-11-09
JP2011208126A2011-10-20
JP2020007397A2020-01-16
JPS6077652A1985-05-02
JPH09268223A1997-10-14
Other References:
See also references of EP 3919541A4
Attorney, Agent or Firm:
YAMAO, Norihito et al. (JP)
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