Title:
METHOD FOR PRODUCING ELECTRONIC COMPONENT, AND ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2019/039335
Kind Code:
A1
Abstract:
Provided are: a method for producing an electronic component, which is capable of producing an electronic component that has a coaxial structure more easily; and an electronic component. This method for producing an electronic component comprises: a pillar formation step wherein a conductive pillar (4) is formed on a surface (121) of a supporting body (120); an intermediate layer formation step wherein an intermediate layer (70) that covers the lateral surface of the pillar (4) is formed; a conductor layer formation step wherein a conductor layer (60) that covers the lateral surface of the intermediate layer (70) is formed; and a resin formation step wherein a resin structure (30) that covers the lateral surface of the conductor layer (60) is formed.
Inventors:
IWAMOTO TAKASHI
Application Number:
PCT/JP2018/030182
Publication Date:
February 28, 2019
Filing Date:
August 13, 2018
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H05K3/46; H01L23/12; H01L25/10; H01L25/11; H01L25/18; H05K1/02
Domestic Patent References:
| WO2014178153A1 | 2014-11-06 |
Foreign References:
| JP2010538463A | 2010-12-09 | |||
| US20180151389A1 | 2018-05-31 | |||
| JP2002016327A | 2002-01-18 |
Attorney, Agent or Firm:
HOKUTO PATENT ATTORNEYS OFFICE (JP)
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