Title:
ELECTRONIC COMPONENT MODULE AND METHOD FOR PRODUCING ELECTRONIC COMPONENT MODULE
Document Type and Number:
WIPO Patent Application WO/2019/039336
Kind Code:
A1
Abstract:
The present invention suppresses deterioration of the performance of an electromagnetic shield that blocks electromagnetic waves from the outside. An electronic component module (1) according to the present invention is provided with: an electronic component (2); a resin structure (3); a wiring part such as a wiring layer (5); and a shield part (6). The resin structure (3) covers at least a part of a lateral surface (23) and a second main surface of the electronic component (2). The wiring part is electrically connected to the electronic component (2). The shield part (6) comprises a first conductor layer (61) and a second conductor layer (62). The first conductor layer (61) is arranged between the electronic component (2) and the resin structure (3) at a distance from the electronic component (2), and has electrical conductivity. The second conductor layer (62) is arranged between the wiring part and the resin structure (3) at a distance from the wiring part, and has electrical conductivity. The first conductor layer (61) and the second conductor layer (62) are integrated with each other in the shield part (6).
Inventors:
IWAMOTO TAKASHI
Application Number:
PCT/JP2018/030183
Publication Date:
February 28, 2019
Filing Date:
August 13, 2018
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01L23/00; H01L23/12; H01L25/10; H01L25/11; H01L25/18; H05K1/02
Foreign References:
| US20160163682A1 | 2016-06-09 | |||
| JP2013187434A | 2013-09-19 | |||
| US20140175623A1 | 2014-06-26 |
Attorney, Agent or Firm:
HOKUTO PATENT ATTORNEYS OFFICE (JP)
Download PDF:
Previous Patent: METHOD FOR PRODUCING ELECTRONIC COMPONENT, AND ELECTRONIC COMPONENT
Next Patent: INNER WALL AND SUBSTRATE TREATMENT DEVICE
Next Patent: INNER WALL AND SUBSTRATE TREATMENT DEVICE