Title:
METHOD FOR PRODUCING ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/019166
Kind Code:
A1
Abstract:
A method for producing an electronic device comprising at least: a step (A) for preparing a structure (100) which is provided with an electronic component (30) that has a circuit formation surface (30A), and an adhesive film (50) that is bonded to the circuit formation surface (30A) side of the electronic component (30); a step (B) for back grinding the surface of the electronic component (30) on the reverse side of the circuit formation surface (30A); and a step (C) for removing the adhesive film (50) from the electronic component (30) after irradiating the adhesive film (50) with UV rays. The adhesive film (50) comprises a base material layer (10) and a UV curable adhesive resin layer (20) that is provided on one surface of the base material layer (10), and the 60° peel strength of the adhesive film (50), as measured using the following method, after being irradiated with UV rays is 0.4N/25mm to 5.0N/25mm, inclusive. (Method) The adhesive film (50) is affixed to a silicon mirror wafer so that the adhesive resin layer (20) is in contact with the silicon mirror wafer. Subsequently, a high-pressure mercury lamp is used to irradiate the adhesive resin layer (20) in an environment of 25°C with UV rays having a main wavelength of 365nm at an irradiation intensity of 100 mW/cm2 and a UV ray amount of 1,080 mJ/cm2, thereby UV curing the adhesive resin layer (20). Then, a tensile testing machine is used to peel the adhesive film (50) from the silicon mirror wafer at 23°C and a speed of 150 mm/min in a 60° direction, and the strength (N/25mm) at that time serves as the 60° peel strength.
Inventors:
YASUI HIROTO (JP)
KURIHARA HIROYOSHI (JP)
KINOSHITA JIN (JP)
KURIHARA HIROYOSHI (JP)
KINOSHITA JIN (JP)
Application Number:
PCT/JP2021/026141
Publication Date:
January 27, 2022
Filing Date:
July 12, 2021
Export Citation:
Assignee:
MITSUI CHEMICALS TOHCELLO INC (JP)
International Classes:
C09J11/06; C09J7/38; C09J133/06; H01L21/02; H01L21/304
Domestic Patent References:
| WO2019189069A1 | 2019-10-03 |
Foreign References:
| JP2016072546A | 2016-05-09 |
Attorney, Agent or Firm:
HAYAMI Shinji (JP)
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