Title:
METHOD FOR PRODUCING FILM
Document Type and Number:
WIPO Patent Application WO/2023/234177
Kind Code:
A1
Abstract:
A method for producing a film, in which a slot die is used to form, on a substrate, a coating film having a width of 1,600 mm or larger and a thickness of 30 μm or less. The method comprises an application step in which a coating fluid is applied to the substrate and a drying step in which the coating fluid applied to the substrate is dried, the shim of the slot die having a thickness of 20-100 μm.
Inventors:
MORIMOTO YU (JP)
TAKAHASHI NORIAKI (JP)
OMOTO ATSUSHI (JP)
HASHIMOTO NAOKI (JP)
TAKAHASHI NORIAKI (JP)
OMOTO ATSUSHI (JP)
HASHIMOTO NAOKI (JP)
Application Number:
PCT/JP2023/019553
Publication Date:
December 07, 2023
Filing Date:
May 25, 2023
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
B05D1/26; B05C5/02; B05D3/00; B05D7/00; B05D7/24; C09D201/00
Domestic Patent References:
| WO2021157664A1 | 2021-08-12 |
Foreign References:
| JP2018013569A | 2018-01-25 | |||
| JP2012115788A | 2012-06-21 | |||
| JP2009018227A | 2009-01-29 | |||
| JP2003275652A | 2003-09-30 | |||
| JP2011194291A | 2011-10-06 | |||
| JP2013212492A | 2013-10-17 | |||
| JP2015073928A | 2015-04-20 | |||
| JP2016073952A | 2016-05-12 |
Attorney, Agent or Firm:
IKUMI PATENT ATTORNEYS OFFICE (JP)
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