Title:
METHOD FOR PRODUCING MULTILAYER BODY, MULTILAYER BODY AND METHOD FOR PRODUCING SEMICONDUCTOR PACKAGE
Document Type and Number:
WIPO Patent Application WO/2022/030390
Kind Code:
A1
Abstract:
The present invention relates to a method for producing a multilayer body, said method comprising: a step for forming a multilayer body precursor which sequentially comprises a first glass substrate, a thermosetting resin layer and a second glass substrate that has a higher average thermal expansion coefficient than the first glass substrate in this order; a step for obtaining a resin layer by subjecting the multilayer body precursor to a heat treatment, thereby thermally curing the thermosetting resin layer, while causing the first glass substrate and the second glass substrate to expand; and a step for obtaining a multilayer body having a warp by cooling the multilayer body precursor, which has been subjected to thermal curing.
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Inventors:
YAMADA KAZUO (JP)
Application Number:
PCT/JP2021/028374
Publication Date:
February 10, 2022
Filing Date:
July 30, 2021
Export Citation:
Assignee:
AGC INC (JP)
International Classes:
B32B17/10; B32B37/14; C03C27/10; H01L23/12; H01L23/14; H01L23/15
Domestic Patent References:
| WO2008142814A1 | 2008-11-27 |
Foreign References:
| JP2013238678A | 2013-11-28 | |||
| JPH10338556A | 1998-12-22 | |||
| JP2015151326A | 2015-08-24 | |||
| JP2018142530A | 2018-09-13 | |||
| JP2001249185A | 2001-09-14 | |||
| JPS62167380A | 1987-07-23 |
Attorney, Agent or Firm:
EIKOH PATENT FIRM, P.C. (JP)
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