METHOD FOR PRODUCING POROUS RESIN SUBSTRATE HAVING HOLE BORED THERETHROUGH AND POROUS RESIN SUBSTRATE PROVIDED WITH HOLE HAVING INNER WALL SURFACE IMPARTED WITH ELECTROCONDUCTIVITY

Title:

METHOD FOR PRODUCING POROUS RESIN SUBSTRATE HAVING HOLE BORED THERETHROUGH AND POROUS RESIN SUBSTRATE PROVIDED WITH HOLE HAVING INNER WALL SURFACE IMPARTED WITH ELECTROCONDUCTIVITY

Document Type and Number:

WIPO Patent Application WO/2006/022083

Kind Code:

A1

Abstract:

A method for producing a porous resin substrate having a hole bored therethrough, which comprises a step (1) of boring at least one hole passing through a porous resin substrate formed form a resin material containing a fluorine-containing polymer in the thickness direction, a step (2) of contacting the surface of the inner wall with an etching solution containing an alkali metal, to subject the surface to an etching treatment, and a step (3) of contacting a modified layer formed by the etching treatment with a compound having oxidizing power or a solution thereof, to thereby remove said modified layer; the method for producing a porous resin substrate which further comprises imparting electroconductivity to the surface of the inner wall of said hole bored therethrough.

Inventors:

UENOYAMA MAYO
OKUDA YASUHIRO
HAYASHI FUMIHIRO
FUJITA TARO
MASUDA YASUHITO
IDOMOTO YUICHI

Application Number:

PCT/JP2005/012768

Publication Date:

March 02, 2006

Filing Date:

July 11, 2005

Export Citation:

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Assignee:

SUMITOMO ELECTRIC INDUSTRIES (JP)
UENOYAMA MAYO
OKUDA YASUHIRO
HAYASHI FUMIHIRO
FUJITA TARO
MASUDA YASUHITO
IDOMOTO YUICHI

International Classes:

H05K3/00; H05K3/26; H05K3/42; (IPC1-7): H05K3/42; H05K3/00; H05K3/26

Foreign References:

JP2000504494A	2000-04-11
JPH05237141A	1993-09-17
JPS6358708A	1988-03-14
JPH09501802A	1997-02-18
JP2003059611A	2003-02-28
JPH09320667A	1997-12-12
JPH0249385A	1990-02-19
JP2003022849A	2003-01-24

Other References: