METHOD FOR PRODUCING SCINTILLATOR ARRAY

Title:

METHOD FOR PRODUCING SCINTILLATOR ARRAY

Document Type and Number:

WIPO Patent Application WO/2012/147747

Kind Code:

A1

Abstract:

In this method for producing a dual array-type scintillator array, a plurality of grooves are formed in first and second scintillator substrates, after which the substrates are cut in the direction orthogonal to the groves to thereby form first and second scintillator sticks having cell parts. A plurality of first and second scintillator sticks are fixed side by side on a support plate with the cell parts facing downward and spacers interposed therebetween. Respective interconnecting parts of the first and second scintillator sticks are removed by grinding to thereby form a first and second cell array in which first and second cells are each lined up in a row. The grooves and gaps of the first and second cell arrays are filled in with a reflective resin material, which is cured, and the support plate is subsequently removed to thereby form an integrated cured-resin aggregate. The resin layers between adjacent groups of first and second cell arrays are cut to thereby divide the cured-resin aggregate for each group of the first and second cell arrays.

Inventors:

SHIGEKAWA AKIRA (JP)
NITTA HIDEO (JP)
SHIOTA SATOSHI (JP)

Application Number:

PCT/JP2012/060980

Publication Date:

November 01, 2012

Filing Date:

April 24, 2012

Export Citation:

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Assignee:

HITACHI METALS LTD (JP)
SHIGEKAWA AKIRA (JP)
NITTA HIDEO (JP)
SHIOTA SATOSHI (JP)

International Classes:

G01T1/20

Domestic Patent References:

WO2007105288A1	2007-09-20
WO2006114715A2	2006-11-02

Foreign References:

JP2010091336A	2010-04-22
JP2004061492A	2004-02-26
JP2004003970A	2004-01-08
US4511799A	1985-04-16
JP2008538966A	2008-11-13
JP2002236182A	2002-08-23
US6793857B2	2004-09-21
JP2001174564A	2001-06-29
JP2009524015A	2009-06-25

Other References: