Title:
METHOD FOR PRODUCING SEMICONDUCTOR PACKAGE
Document Type and Number:
WIPO Patent Application WO/2018/135708
Kind Code:
A1
Abstract:
Provided is a method for producing a semiconductor package comprising a step for forming an interconnected structure, the method according to the technical concept of the present invention comprising the steps of: arranging a plurality of wafers on a tray; forming the interconnected structure on top of the tray and plurality of wafers; and separating the plurality of wafers from the tray.
Inventors:
KIM NAM CHUL (KR)
YEO YONG WOON (KR)
KWON YONG TAE (KR)
LEE YOUNG SEOK (KR)
YEO YONG WOON (KR)
KWON YONG TAE (KR)
LEE YOUNG SEOK (KR)
Application Number:
PCT/KR2017/004830
Publication Date:
July 26, 2018
Filing Date:
May 10, 2017
Export Citation:
Assignee:
NEPES CO LTD (KR)
International Classes:
H01L21/673; H01L23/04; H01L23/522
Foreign References:
| KR20170003352A | 2017-01-09 | |||
| JP2015504608A | 2015-02-12 | |||
| KR20150065544A | 2015-06-15 | |||
| KR20120138517A | 2012-12-26 | |||
| KR20100077818A | 2010-07-08 |
Attorney, Agent or Firm:
Y.P.LEE, MOCK & PARTNERS (KR)
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