Title:
TRAY FOR PRODUCING SEMICONDUCTOR PACKAGE
Document Type and Number:
WIPO Patent Application WO/2018/135707
Kind Code:
A1
Abstract:
Provided is a tray for producing a semiconductor package, the tray being utilized in a semiconductor package process according to the technical concept of the present invention, wherein the tray is provided with a plurality of cavities so that a plurality of wafers can be placed therein.
Inventors:
KIM NAM CHUL (KR)
YEO YONG WOON (KR)
KWON YONG TAE (KR)
LEE YOUNG SEOK (KR)
YEO YONG WOON (KR)
KWON YONG TAE (KR)
LEE YOUNG SEOK (KR)
Application Number:
PCT/KR2017/004829
Publication Date:
July 26, 2018
Filing Date:
May 10, 2017
Export Citation:
Assignee:
NEPES CO LTD (KR)
International Classes:
H01L21/673; H01L23/04; H01L23/522
Foreign References:
| JP2015504608A | 2015-02-12 | |||
| KR20100074126A | 2010-07-01 | |||
| KR20080013820A | 2008-02-13 | |||
| KR20150065544A | 2015-06-15 | |||
| KR20120138517A | 2012-12-26 |
Attorney, Agent or Firm:
Y.P.LEE, MOCK & PARTNERS (KR)
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