Title:
METHOD FOR PRODUCING SILVER POWDER
Document Type and Number:
WIPO Patent Application WO/2021/193575
Kind Code:
A1
Abstract:
[Problem] To provide a method for producing a silver powder which can have a smaller particle size distribution than ever before without the need to change the type of a surface treatment agent, and which has such a property that, when the silver powder is made into a paste to form an electrode, the electrode can have low resistance. [Solution] In the process for producing a silver powder, an O/W-type emulsion containing micelles of a surface treating agent having a volume-based cumulative 50% particle diameter D50 obtained by a laser diffraction particle size distribution measurement method of 1.5 μm or less is added to a slurry of a silver powder, whereby the dispersibility of the silver powder in the slurry containing the silver powder is improved.
Inventors:
SUGAWARA SATOKO (JP)
Application Number:
PCT/JP2021/011808
Publication Date:
September 30, 2021
Filing Date:
March 22, 2021
Export Citation:
Assignee:
DOWA ELECTRONICS MATERIALS CO (JP)
International Classes:
B22F1/00; B22F1/102; B22F9/24; H01B13/00
Domestic Patent References:
| WO2013073607A1 | 2013-05-23 | |||
| WO2013133103A1 | 2013-09-12 |
Foreign References:
| JPH1088207A | 1998-04-07 | |||
| JP2011068932A | 2011-04-07 |
Attorney, Agent or Firm:
KOMATSU Takashi (JP)
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