Title:
METHOD FOR PRODUCING THERMOSETTING RESIN COMPOSITION AND METHOD FOR PRODUCING ELECTRONIC COMPONENT DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/149603
Kind Code:
A1
Abstract:
This method for producing a thermosetting resin composition has: a desolventizing step for obtaining a second mixture from a first mixture which contains a thermosetting resin, a curing agent, and a slurry containing an inorganic filler and a solvent by removing the solvent at a first desolventizing temperature; and a kneading step for adding a curing accelerator to the second mixture and kneading the second mixture to which the curing accelerator has been added at a first kneading temperature which is lower than the first desolventizing temperature.
Inventors:
YAMAURA MASASHI (JP)
NAKAMURA TAKEHIRO (JP)
HONG CHANGHOON (JP)
KANG DONGCHUL (JP)
HIRAJIMA KATSUYUKI (JP)
NOZAWA HIROSHI (JP)
NAKAMURA TAKEHIRO (JP)
HONG CHANGHOON (JP)
KANG DONGCHUL (JP)
HIRAJIMA KATSUYUKI (JP)
NOZAWA HIROSHI (JP)
Application Number:
PCT/JP2022/000277
Publication Date:
July 14, 2022
Filing Date:
January 06, 2022
Export Citation:
Assignee:
SHOWA DENKO MATERIALS CO LTD (JP)
International Classes:
H01L23/29; B29B7/88; C08K3/013; C08L63/00; C08L101/00; H01L23/31
Domestic Patent References:
| WO2011118584A1 | 2011-09-29 | |||
| WO2005038519A1 | 2005-04-28 |
Foreign References:
| JP2014080455A | 2014-05-08 | |||
| JP2014122292A | 2014-07-03 | |||
| JP2008088350A | 2008-04-17 |
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
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