Title:
THERMOSETTING RESIN COMPOSITION AND ELECTRONIC COMPONENT DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/149602
Kind Code:
A1
Abstract:
This thermosetting resin composition contains a thermosetting resin, a curing agent, and an inorganic filler material, wherein: in a particle size distribution on a volume basis as measured by a particle size distribution measurement device using a laser scattering diffraction method, the particle size of the inorganic filler material at the time that the cumulative particle size starting from the smallest diameter particles reaches 90% is no more than 25 μm; and disk flow at 180 °C exceeds 110 mm.
Inventors:
KANG DONGCHUL (JP)
YAMAURA MASASHI (JP)
NAKAMURA TAKEHIRO (JP)
NOZAWA HIROSHI (JP)
HONG CHANGHOON (JP)
HIRAJIMA KATSUYUKI (JP)
YAMAURA MASASHI (JP)
NAKAMURA TAKEHIRO (JP)
NOZAWA HIROSHI (JP)
HONG CHANGHOON (JP)
HIRAJIMA KATSUYUKI (JP)
Application Number:
PCT/JP2022/000276
Publication Date:
July 14, 2022
Filing Date:
January 06, 2022
Export Citation:
Assignee:
SHOWA DENKO MATERIALS CO LTD (JP)
International Classes:
C08G59/40; C08K3/013; C08L63/00; C08L101/00; H01L23/29; H01L23/31
Domestic Patent References:
| WO2019131095A1 | 2019-07-04 | |||
| WO2017038941A1 | 2017-03-09 | |||
| WO2019187249A1 | 2019-10-03 |
Foreign References:
| JP2018188580A | 2018-11-29 | |||
| JP2020084038A | 2020-06-04 | |||
| JP2017088844A | 2017-05-25 | |||
| JP2012255130A | 2012-12-27 |
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
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