Title:
METHOD FOR PRODUCING THIN PLATE-LIKE LAMINATE HAVING FILM-LIKE RESIN LAYER
Document Type and Number:
WIPO Patent Application WO/2020/196152
Kind Code:
A1
Abstract:
[Problem] To provide a method for producing a thin plate-like laminate having a film-like resin layer, the method being capable of stably forming a recess-and-protrusion shape, with high accuracy, on a film-like resin layer laminated on a thin plate-like substrate. [Solution] This method includes: a step for creating a mold holding structure 100 in which a mold 110 heated to the heat distortion temperature of a film-like resin composition 84 is arranged on both surface sides of a workpiece 85; and a step for introducing, between two pressure rolls 52 and 54, the mold holding structure in which the heated mold is arranged, pinching the mold holding structure from the outer surface of the mold by rotating a pressure roll to thermally –compress and bond the film-like resin composition and a substrate 81 into a single body, and forming a thin plate-like laminate 80 having a film-like resin layer 82.
Inventors:
IMAIZUMI TAKUZO (JP)
GOTO NAOMI (JP)
SHIBA NAOKI (JP)
GOTO NAOMI (JP)
SHIBA NAOKI (JP)
Application Number:
PCT/JP2020/011963
Publication Date:
October 01, 2020
Filing Date:
March 18, 2020
Export Citation:
Assignee:
FUTAMURA KAGAKU KK (JP)
International Classes:
B32B27/06; B29C43/18; B29C43/52
Foreign References:
| JPH10282315A | 1998-10-23 | |||
| JP2009158731A | 2009-07-16 |
Other References:
See also references of EP 3950331A4
Attorney, Agent or Firm:
KATO Hiroki et al. (JP)
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