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Patent Searching and Data


Title:
DEVICE FOR MANUFACTURING THIN-PLATE LAMINATE HAVING FILM-SHAPED RESIN LAYER
Document Type and Number:
WIPO Patent Application WO/2020/196151
Kind Code:
A1
Abstract:
[Problem] To provide an apparatus for manufacturing a thin-plate laminate having a film-shaped resin layer, the thin-plate laminate being capable of forming uneven shapes on the film-shaped resin layer that is laminated on a thin-plate-shaped substrate in a highly precise and stable manner. [Solution] An apparatus comprising: a setting device 31 that creates a mold holding structure 100 where a mold 110 is placed on both face sides of a work material 85; a heating device 41 that heats the mold to a thermal deformation temperature of a film-shaped resin composition 84; a compressing roll device 51 that, following heating of the mold, introduces the mold holding structure between two compressing rollers 52 and 54 to pressurizedly compress the mold from outer faces of the mold by rotation of the pressurizing rollers for integral thermocompression bonding of the film-shaped resin composition and a substrate 81, thus forming a thin-plate-shaped laminate 80 having a film-shaped resin layer 82; and an extracting device 61 that extracts the mold from the mold holding structure following pressurized compression.

Inventors:
IMAIZUMI TAKUZO (JP)
GOTO NAOMI (JP)
SHIBA NAOKI (JP)
Application Number:
PCT/JP2020/011962
Publication Date:
October 01, 2020
Filing Date:
March 18, 2020
Export Citation:
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Assignee:
FUTAMURA KAGAKU KK (JP)
International Classes:
B29C63/02; B29C65/02; B32B27/00; B32B37/00
Foreign References:
JPH10282315A1998-10-23
JP2009158731A2009-07-16
JP2018200931A2018-12-20
Other References:
See also references of EP 3950272A4
Attorney, Agent or Firm:
KATO Hiroki et al. (JP)
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